Quality control of solder connections of electronic assemblies
Автор: Ivanov Andrey, Piganov Mikhail
Журнал: Известия Самарского научного центра Российской академии наук @izvestiya-ssc
Рубрика: Информатика, вычислительная техника и управление
Статья в выпуске: 4-7 т.18, 2016 года.
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Failures of solder connections of surface mounting on multilayer printed circuit board were described. The questions of fatigue strength of solder connections were considered. engelmeyer’s models of quality and reliability and wilde’s mathematical models were analyzed. The test task of assessment of the adequacy of reliability model was offered and solved. The comparative data of reliability calculation results on program «Solder-1» with the parameters of the test task was received.
Electronic assembly, solder connection, solder, quality, reliability, fatigue strength, reliability models, calculation program, comparative evaluation
Короткий адрес: https://sciup.org/148204863
IDR: 148204863
