Engineering calculations of thermal influence internal elements

In the article the work, the aim of which is to conduct engineering analysis in the calculation of the thermal performance of electronic circuit boards switching module with the defined for each radio component power. In the course of the work methods used in computer simulation software product Siemens NX, software systems for engineering calculations Ansys Workbench and IcePak, finite element method. The investigations of the electronic boards in a variety of temperature conditions. The results of the work are the temperature readings in electronic circuit boards, temperature readings on separate radio elements, as well as the heat flow behavior inside and outside the switching module.