Analysis and optimization of heat sink design for high-power laser diodes. I. Conventional heat sink

The first part of our work analyzes heat transfer in the high-power laser diodes (LDs) of conventional design. Contributions of various design units to the total thermal resistance of the LDs is considered, demonstrating a dominant one coming from the copper heat sink and case of the laser. The reason for this is strong localization of the heat release in the laser chip as well as a two-dimensional character of the heat transfer around the chip. The theoretical results obtained agree well with the measurements of the thermal resistance carried out.